Sputtering Equipment - メーカー・企業6社の製品一覧とランキング | イプロス

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Sputtering Equipmentのメーカー・企業ランキング

更新日： 集計期間:Jan 14, 2026～Feb 10, 2026
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  1. FKDファクトリ Tokyo//Service Industry
  2. テルモセラ・ジャパン Tokyo//Trading company/Wholesale
  3. 京浜ラムテック Kanagawa//others
  4. 4 長州産業 Yamaguchi//others
  5. 5 Tohoku Techno Arch Co., Ltd. Miyagi//Educational and Research Institutions
企業ランキングへ

Sputtering Equipmentの製品ランキング

更新日： 集計期間:Jan 14, 2026～Feb 10, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. MiniLab-SA125A Multi-Target Magnetron Sputtering System テルモセラ・ジャパン
  2. Tabletop Magnetron Sputtering Device "FDS/FRS Series" FKDファクトリ
  3. Multi-source simultaneous magnetron sputtering device "FRS-HG Series" FKDファクトリ
  4. Solving the challenges of conventional sputtering technology with "RAM Force"! 京浜ラムテック
  5. 4 Multivariate Multi-Sputtering Device [MiniLab-S125A] テルモセラ・ジャパン

Sputtering Equipmentの製品一覧

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Sputtering device

Sputtering device

Sputtering device

We provide the "Mirrortron sputtering device," which features Choshu Industry's unique technology and employs a counter-target method. It achieves low plasma damage and low substrate temperatures while allowing for the desired functional films to be obtained. In the field of organic EL, it is ideal for forming transparent conductive films in top-emission structures and for creating sealing films. We offer optimal processes across various fields, including organic devices such as organic solar cells and organic semiconductors, electronic components, and resin films. Additionally, we also provide sputtering devices using parallel plate and cylindrical methods.

  • Organic EL light source
  • Sputtering Equipment

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MiniLab-SA125A Multi-Target Magnetron Sputtering System

MiniLab-SA125A Multi-Target Magnetron Sputtering System

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 elements simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured for multi-cathode using our unique 'Plasma Switching Relay' module, allowing for versatile applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SiC coating) Reverse sputtering stage inside the load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

  • Air conditioning equipment
  • Duct related equipment
  • Sputtering Equipment

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Solving the challenges of conventional sputtering technology with "RAM Force"!

Solving the challenges of conventional sputtering technology with "RAM Force"!

Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.

"RAM Force" is a roll-to-roll sputtering device capable of depositing multilayer films such as optical films and metals onto plastic films. Not only can it evaluate the performance of the RAM cathode (low-damage cathode), but it also allows you to test your applications under lab conditions and transition from pilot lines to mass production lines. 【Features】 ■ Patent granted ■ Reduces damage to substrates by over 60% * Comparison between conventional flat sputtering and RAM cathode ■ Increases deposition speed by more than three times * Comparison between conventional opposing sputtering and RAM cathode ■ Unique technology from Keihin Ramtech * For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Sputtering Equipment

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Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.

The "FDS/FRS Series" is a tabletop magnetron sputtering device for research and development, equipped with the necessary functions. The basic specifications consist of a DC sputter/single cathode/rotary pump for metal thin film sputtering. With expansion options such as RF conversion, additional cathodes, and turbo molecular pump specifications, it can be upgraded to match the research stage. 【Features】 ■ Keeps initial introduction costs low while allowing for high performance upgrades later ■ Comes with an MFC for argon in the basic specifications, enabling precise control of gas flow ■ Adopts a deposition-up method to prevent dust from adhering to the sample during film formation ■ Utilizes a high vacuum-sealing SUS chamber despite being a tabletop type *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Sputtering Equipment

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Tohoku University Technology: High-density plasma sputtering device: T16-141

Tohoku University Technology: High-density plasma sputtering device: T16-141

Damage-less sputtering / Independent control of ion energy and flux / Useable in ferromagnetic target

With the increase of request for device miniaturization and thin crystal film quality improvement, the ion damage on substrate has become a major issue in sputtering. The magnetron sputtering method is widely used but since the plasma is formed directly between the target material and the substrate, “1 it is difficult to avoid ion damage”. This issue is amplified when generating highdensity plasma. In addition, since a single power supply is responsible for both the plasma generation and ion attraction, “2 it is impossible to independently control the ion flux and energy flowing into the target material”. Moreover, since the plasma is confined by the magnetic leakage flux on the target surface, “3 it is difficult to use for ferromagnetic material target”. 　This invention solves above 1/2/3 issues by generating highdensity plasma with helicon discharge and by controlling the plasma shape with a curved magnetic field, etc. This invention could also be considered to be used as a heating mechanism of the target material, or as an uniform & fast film deposition.

  • others
  • Sputtering Equipment

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Multilayer film sputtering device 'S600'

Multilayer film sputtering device 'S600'

Equipped with a heater stage (1000℃)! Usable for various applications from development to mass production processes.

The S600 is a multilayer sputtering device that contributes to the enhancement of electronic component quality and productivity through improvements in multilayer and laminated film deposition processes. By achieving high-quality and high-precision film deposition, it enhances device quality. It increases cost competitiveness through high throughput, improved production yield, and optimized material utilization efficiency. With options that accommodate a variety of film deposition conditions, it is capable of supporting small-batch production and flexible production planning. 【Features】 ■ Supports diverse processes and high productivity with up to 5 cathodes ■ Maintains long-term uniformity of film thickness through T/S distance adjustment ■ Improves sputtered thin film characteristics with unique plasma control (MP sputtering) technology ■ Capable of high-temperature processes with a heater stage (1000°C) ■ Usable for various applications from development processes to mass production *For more details, please refer to the PDF document or feel free to contact us.

  • Manufacturing Equipment
  • Sputtering Equipment

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Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Easy discharge operation! Compact design featuring automatic matching for RF power supply.

The "FRS-HG Series" is a multi-source simultaneous magnetron sputtering device equipped with simultaneous sputtering functionality for 2 sources or 3 sources, designed for research and development. Despite being a fixed type, it features a compact and stylish design. There are three film source introduction ports available, allowing for the installation of film sources that can synergize with sputtering, such as sputtering cathodes and arc plasma deposition sources. 【Features】 - Compact and stylish design despite being a fixed type - Auto-matching is employed for the RF power supply, making discharge operation easy - Simultaneous film deposition from 2 or 3 sources allows for fine-tuning of thin film functions and performance *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Sputtering Equipment

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Multivariate Multi-Sputtering Device [MiniLab-S125A]

Multivariate Multi-Sputtering Device [MiniLab-S125A]

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 element simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured in multi-cathode arrangements using our unique 'Plasma Switching Relay' module, allowing for versatile applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage in load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

  • Air conditioning equipment
  • Duct related equipment
  • Sputtering Equipment

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